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sense & control data sheet rev. 1.1, 2015-03-12 TLE5012BD angle sensor gmr-based dual die angle sensor
TLE5012BD data sheet 2 rev. 1.1, 2015-03-12 trademarks of infineon technologies ag aurix?, c166?, canpak?, ci pos?, cipurse?, econopac k?, coolmos?, coolset?, corecontrol?, crossav e?, dave?, di-pol?, easypim?, econobridge?, econodual?, econopim?, econopack?, eicedriver?, eupec?, fcos?, hitfet?, hybridpack?, i2rf?, isoface?, isopack?, mipaq?, modstack?, my-d?, novalithic?, optimos?, origa?, powercode?; primarion?, pr imepack?, primestack?, pr o-sil?, profet?, rasic?, reversave?, satric?, si eget?, sindrion?, sipmos?, smartl ewis?, solid flash?, tempfet?, thinq!?, trenchstop?, tricore?. other trademarks advance design system? (ads) of agilent te chnologies, amba?, arm?, multi-ice?, keil?, primecell?, realview?, thumb?, vision? of arm limited, uk. autosar? is licensed by autosar development partnership. bluetooth? of bluetooth sig inc. cat-iq? of dect forum. colossus?, firstgps? of trimble navigation ltd. emv? of emvc o, llc (visa holdings in c.). epcos? of epcos ag. flexgo? of microsoft corp oration. flexray? is licensed by flexray consortium. hyperterminal? of hilgraeve incorporated. iec? of commission electrot echnique internationale. irda? of infrared data association corporation. iso? of international organization for standardization. matlab? of mathworks, inc. maxim? of maxim integrated products, inc. microtec?, nucleus? of mentor graphics corporation. mipi? of mipi allianc e, inc. mips? of mips technologies, inc., u sa. murata? of murata manufacturing co., microwave office? (mwo) of applied wave research inc., omnivision? of omnivision technologies, inc. openwave? openwave systems inc. red hat? red hat, inc. rfmd? rf micro devices, inc. sirius? of si rius satellite radio inc. solaris? of sun microsystems, inc. spansion? of spansion llc ltd. symbian? of symbian software limited. taiyo yuden? of taiyo yuden co. teaklite? of ceva, inc. tektro nix? of tektronix inc. toko? of toko kabushiki kaisha ta. unix? of x/open company limited. verilo g?, palladium? of cadence design systems, inc. vlynq? of texas instruments incorpor ated. vxworks?, wind river? of wind ri ver systems, inc. zetex? of diodes zetex limited. last trademarks update 2011-11-11 revision history page or item subjects (major changes since previous revision) rev. 1.1, 2015-03-12 6 table 1-1: package version number removed 10 table 4-2 esd protection modified 13 figure 6-2 and table 6-2 updated wit h improved chip placement tolerance 16 figure 6-5 added with ma rking on frontside and backside
TLE5012BD table of contents data sheet 3 rev. 1.1, 2015-03-12 table of contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 list of figures . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 list of tables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 preface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 1 product description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 1.1 overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 1.2 features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 1.3 application example . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 2 pin configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 2.1 pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 3 dual die angle output . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 4 specification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 4.1 absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 4.2 calculation of the junction temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 5 pre-configured derivates . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 5.1 iif-type: e1200 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 5.2 spc-type: e9200 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 6 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 6.1 package parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 6.2 package outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 6.3 footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 6.4 packing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 6.5 marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 table of contents
TLE5012BD list of figures data sheet 4 rev. 1.1, 2015-03-12 figure 1-1 pg-tdso-16 package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 figure 2-1 pin configuration (top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 figure 3-1 dual die angle output . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 figure 6-1 pg-tdso-16 package dimension . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 figure 6-2 position of sensing element . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 figure 6-3 footprint of pg-tdso-16 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 figure 6-4 tape and reel . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 figure 6-5 marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 list of figures
TLE5012BD list of tables data sheet 5 rev. 1.1, 2015-03-12 table 1-1 derivate ordering codes (see chapter 5 for description of derivates). . . . . . . . . . . . . . . . . . . . . . . 6 table 2-1 pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 table 4-1 absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 table 4-2 esd protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 table 6-1 package parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 table 6-2 sensor ic placement tolerances in package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 list of tables
TLE5012BD product description data sheet 6 rev. 1.1, 2015-03-12 preface this document is an addendum to the tle5012b datas heet and describes the TLE5012BD dual die angle sensor. for all parameters which are not specifie d here, the tle5012b datasheet is valid. 1 product description figure 1-1 pg-tdso-16 package 1.1 overview the TLE5012BD is a fully redundant 360 angle sensor that detects the orientation of a magnetic field. this is achieved by measuring sine and cosi ne angle components with monolithic i ntegrated giant magneto resistance (igmr) elements. highly precise angle values are determined over a wide temperature range and a long lifetime using an internal autocalibration algorithm. data communications are accomplished with a bi-directi onal synchronous serial communication (ssc) that is spi-compatible. the absolute angle value and other values are transmi tted via ssc or via a pulse-width-modulation (pwm) protocol. the sine and cosine raw values can also be read out. these raw signals are digitally processed internally to calculate the angle orientatio n of the magnetic field (magnet). the TLE5012BD is a pre-calibrated sensor. the calibration parameters are stored in la ser fuses. at start-up the values of the fuses are written into flip-flops, where these values can be changed by the application-specific parameters. online diagnostic functions are prov ided to ensure reliable operation. table 1-1 derivate ordering codes (see chapter 5 for description of derivates) product type marking ordering code package TLE5012BD e1200 12bd1200 sp001205296 pg-tdso-16 TLE5012BD e9200 12bd9200 sp001205300 pg-tdso-16
TLE5012BD product description data sheet 7 rev. 1.1, 2015-03-12 1.2 features ? g iant m agneto r esistance (gmr)- based principle ? fully redundant design with two sensor ics in one package ? integrated magnetic field sensing for angle measurement ? 360 angle measurement with revolution counter and angle speed measurement ? two separate highly accurate single bit sd-adc ? 15 bit representation of absolute angle value on the output (resolution of 0.01) ? 16 bit representation of sine / cosine values on the interface ? max. 1.0 angle error over lifetime and temp erature-range with activated auto-calibration ? bi-directional ssc interface up to 8mbit/s ? supports safety integrity level (sil) with diagnostic functions and status information ? interfaces: ssc, pwm, incremental interface (iif), hall switch mode (hsm), short pwm code (spc, based on sent protocol de fined in sae j2716) ? output pins can be configured (programmed or pre-configured) as push-pull or open-drain ? bus mode operation of multiple sensors on one line is possible with ssc or spc interface in open-drain configuration ?0.25 m cmos technology ? aec-q100 automotive qualified ? esd > 4kv (hbm) ? green package with lead-free (pb-free) plating, halogene free 1.3 application example the TLE5012BD gmr-based dual die angle sensor is designed for angular position sensing in automotive applications such as: ? electrical commutated motor (e .g. used in electric power st eering (eps) and actuators) ? steering angle measurements ? general angular sensing
TLE5012BD pin configuration data sheet 8 rev. 1.1, 2015-03-12 2 pin configuration figure 2-1 pin configuration (top view) 2.1 pin description table 2-1 pin description pin no. symbol in/out function 1ifc1 (clk / iif_idx / hs3) i/o die 1 interface c: external clock 1) / iif index / hall switch signal 3 2 sck1 i die 1 ssc clock 3 csq1 i die 1 ssc chip select 4 data1 i/o die 1 ssc data 5 data2 i/o die 2 ssc data 6 csq2 i die 2 ssc chip select 7 sck2 i die 2 ssc clock 8ifc2 (clk / iif_idx / hs3) i/o die 2 interface c: external clock 1) / iif index / hall switch signal 3 9ifb2 (iif_b / hs2) o die 2 interface b: iif phase b / hall switch signal 2 10 gnd2 - die 2 ground 11 vdd2 - die 2 supply voltage 1 center of sensitive area 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16
TLE5012BD dual die angle output data sheet 9 rev. 1.1, 2015-03-12 3 dual die angle output the bottom sensor element of the TLE5012BD is flipped re lative to the orientation of the top sensor element therefore the rotation direction sensed by the bottom elemen t is opposite to the top el ement. this is advantageous for safety critical applications, as the two sensor elements do generally not output the same angle. figure 3-1 shows the output of the two sensor ics for a given external magnetic field orientation. figure 3-1 dual die angle output for applications where an identical angle output of both ics is desired, the rotation direction and angle offset of one sensor ic can be reconfigured by changing the settin gs in the ang_base and ang_dir registers via ssc interface. 12 ifa2 (iif_a / hs1 / pwm / spc) o die 2 interface a: iif phase a / hall switch signal 1 / pwm / spc output 13 ifa1 (iif_a / hs1 / pwm / spc) o die 1 interface a: iif phase a / hall switch signal 1 / pwm / spc output 14 vdd1 - die 1 supply voltage 15 gnd1 - die 1 ground 16 ifb1 (iif_b / hs2) o die 1 interface b: iif phase b / hall switch signal 2 1) external clock feature is not avai lable in iif or hsm interface mode table 2-1 pin description (cont?d) pin no. symbol in/out function 0 90 180 270 360 90 180 270 360 top sensor output bottom sensor output external magnetic field angle sensor output angle
TLE5012BD specification data sheet 10 rev. 1.1, 2015-03-12 4 specification 4.1 absolute maximum ratings attention: stresses above the max. values listed here may cause permanent damage to the device. exposure to absolute maximum rating conditions for extended periods may affect device reliability. maximum ratings are absolute ratings; exceeding only one of these values may cause irreversible damage to the device. 4.2 calculation of th e junction temperature the total power dissipation p tot of the chips leads to self-heating, which increases the junction temperature t j above the ambient temperature. the power multiplied by the total thermal resistance r thja (junction to ambient) yields the junction temperature. r thja is the sum of the two co mponents junction to ca se and case to ambient. (4.1) table 4-1 absolute maximum ratings parameter symbol values unit note / test condition min. typ. max. ambient temperature t a -40 125 c qualification acc. to aec q100 grade 1 junction temperature t j -40 150 c 150 c for 1000 h, not additive table 4-2 esd protection parameter symbol values unit notes min. max. esd voltage v hbm 4.0 kv 1) ground pins connected 1) human body model (hbm) accord ing to ansi/esda/jedec js-001 v hbm 2.0 kv 1) v cdm 0.5 kv 2) 2) charged device model (cdm) according to jesd22-c101 v cdm 0.75 kv 2) for corner pins ) 2 2 ( + = = + = + = q q q dd dd thja tot thja a j thca thjc thja i v i v r p r t t t t r r r (i dd , i q > 0, if direction is into ic)
TLE5012BD specification data sheet 11 rev. 1.1, 2015-03-12 factors of 2 in the calculation account for the two se nsor ics in the TLE5012BD. example (assuming no load on v out ). (4.2) for molded sensors, the calculation with r thjc is more appropriate. [] [] [ ] () k va a v w k t ma i v v dd dd 8 . 16 0 028 . 0 5 120 28 2 5 = + ? ? ? ? ? ? = = =
TLE5012BD pre-configured derivates data sheet 12 rev. 1.1, 2015-03-12 5 pre-configured derivates derivates of the TLE5012BD are available with different pre- configured register settings for specific applications. the configuration of all derivates can be changed via ssc interface. a detailed table of settings of the derivates can be found in the latest tle5012b register setting user manual 5.1 iif-type: e1200 the TLE5012BD-e1200 is preconfigured for incremental interface and fast angle update rate (42.7 s). it is most suitable for bldc motor commutation. ? autocalibration mode 1 enabled. ? prediction disabled. ? hysteresis is set to 0.625. ? 12bit mode, one count per 0.088 angle step. ? incremental interface a/b mode. 5.2 spc-type: e9200 the TLE5012BD-e9200 is preconfigured for short-pwm-code interface. it is most suitable for steering angle and actuator position sensing. ? angle update time is 85.4 s. ? autocalibration, prediction, and hysteresis are disabled. ? spc unit time is 3 s. ? spc interface is set to open-drain output.
TLE5012BD package information data sheet 13 rev. 1.1, 2015-03-12 6 package information 6.1 package parameters 6.2 package outline figure 6-1 pg-tdso-16 package dimension table 6-1 package parameters parameter symbol limit values unit notes min. typ. max. thermal resistance 1) 1) r th values only valid for both dies supplied with v dd r thja 120 140 k/w junction to air 2) 2) according to jedec jesd51-7 r thjc 35 k/w junction to case r thjl 70 k/w junction to lead moisture sensitivity level msl 3 260c lead frame cu plating sn 100% > 7 m
TLE5012BD package information data sheet 14 rev. 1.1, 2015-03-12 figure 6-2 position of sensing element table 6-2 sensor ic placement tolerances in package parameter values unit notes min. max. position eccentricity -100 100 m in x- and y-direction rotation -3 3 affects zero po sition offset of sensor tilt -3 3 0.2 0.2
TLE5012BD package information data sheet 15 rev. 1.1, 2015-03-12 6.3 footprint figure 6-3 footprint of pg-tdso-16 6.4 packing figure 6-4 tape and reel 6.5 marking the device is marked on the frontside with a date code, the device type and a lot code. on the backside is a 8 x 18 data matrix code. note: for processing recommendations, please refer to infineon?s notes on processing position marking description 1rd line gxxxx g = green, 4-digit = date code 2st line 12bdx2xx type (8 digits), see ordering table 1-1 3nd line xxx lot code (3 digits)
TLE5012BD package information data sheet 16 rev. 1.1, 2015-03-12 figure 6-5 marking
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